Huizhou Dongcheng Laser Technology Co., LTD
Application
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University research and teaching
New materials laboratories, laser applications, mechanical processing, and new energy laboratories at various universities
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New Energy Industry
Laser tab forming is currently one of the main applications of laser cutting in lithium battery manufacturing. Solar photovoltaics, new energy vehicles, hydrogen fuel cells, energy storage, and other industries. For example, in power batteries, laser cutting is primarily used in the manufacturing of battery pole pieces, including laser tab cutting and forming of positive and negative electrodes, laser pole piece cutting, laser pole piece striping, and laser cutting of separators. Laser tab form
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Sapphire, glass and other transparent brittle materials industries;
Including various protective lenses, reflectors, lenses and other optical lenses in the laser industry, glass panels and decorations required for household appliances and home buildings.
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Ceramics and other new materials industries
Ceramic components for semiconductor equipment; special applications in various industries, including solar photovoltaics and new energy vehicles. Ceramic backplanes and panels for 3C products such as mobile phones and watches; ceramic components for semiconductor equipment; special applications in various industries, including solar photovoltaics and new energy vehicles.
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PCB Industry
The PCB industry has evolved from traditional fiberglass boards (green boards) to medium- and high-power copper-aluminum substrates, and now to new ceramic substrates with high strength, high thermal conductivity, and high-voltage resistance. Cutting, drilling, and scribing within these substrates require highly precise and efficient laser processing.
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Semiconductor Chip Industry
Wafer laser cutting machines can be used for wafer reshaping, drilling, and scribing, improving processing efficiency and material utilization. Currently, a large number of chip wafers use single-crystal silicon, polycrystalline silicon, silicon carbide, and other substrate materials. Wafer laser cutting machines can be used for wafer reshaping, drilling, and scribing, improving processing efficiency and material utilization.
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Jewelry and Crafts Manufacturing
Specially developed for cutting precious and high-reflective metals such as silver, gold, copper. With recovery system to save materials.
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Medical Industry
High-Precision Laser Cutting for Medical Snake Bone Tubes Precise processing of medical snake bone tubes used in endoscopic and minimally invasive surgical instruments. The cutting systems deliver micron-level accuracy, smooth edges, and perfect roundness without deformation — ensuring optimal flexibility and performance of each tube segment.
